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  • Last modified:
    November-22-2008

DMSE Faculty

> Harold Kahn

Research Associate Professor (Joined 2002)

  • B.S.(Metallurgical Engineering) Lafayette College, Easton, Pennsylvania, 1985
  • Ph.D.(Electronic Materials) Massachusetts Institute of Technology, 1992

Office: 426 White Phone: 216-368 6384 Email: hxk29@case.edu


Research Interests:
  • Materials for microelectromechanical systems (MEMS)
  • Wafer-level mechanical testing of microfabricated inorganic specimens and nanostructured biological specimens
  • Shape-memory actuated microfluidic devices
  • Diffusional surface hardening of metals


Recent Publications:
  • A. Kaushik, H. Kahn, and A.H. Heuer, “Wafer level mechanical characterization of silicon nitride MEMS,” Journal of Microelectromechanical Systems, 2004, in press.
  • B. Mi, H. Kahn, F. Merat, A.H. Heuer, D.A. Smith, and S.M. Phillips, “Design and fabrication of curved micromirrors using the MultiPoly process,” Journal of Microelectromechanical Systems, 2004, in press.
  • B.-K. Lai, H. Kahn, S.M. Phillips, Z. Akase and A. H. Heuer, “Quantitative Phase Transformation Behavior in TiNi Shape Memory Alloy Thin Films,” Journal of Materials Research, 2004, in press.
  • Y. Wang, R. Ballarini, H. Kahn and A.H. Heuer, “Determination of the Growth Strain of LPCVD Polysilicon,” Journal of Microelectromechanical Systems, 2004, in press.
  • H. Kahn, R. Ballarini, A.H. Heuer, “Dynamic Fatigue of Silicon,” Current Opinion in Solid State and Materials Science, 8 (1), 71-76 (2004).
  • B.-K. Lai, H. Kahn, S.M. Phillips, and A.H. Heuer, “A comparison of PZT-based and TiNi shape memory alloy-based microactuation for MEMS,” Ferroelectrics, 306, 221-226 (2004).
  • H. Kahn, “Mechanical Properties of Micromachined Structures,” in Handbook of Nanotechnology, B. Bhushan, ed. (New York: Springer-Verlag) pp. 1023-1038, 2004.
  • H. Kahn, R. Ballarini, and A.H. Heuer, “Effects of varying mean stress and stress amplitude on the fatigue of polysilicon,” Materials Research Society Symposium Proceedings, Boston, MA, 1-5 Dec 2003, 795, U4.7.1-U4.7.9 (2004).
  • A. Ni, D. Sherman, R. Ballarini, H. Kahn, B. Mi, S.M. Phillips and A.H. Heuer, “Optimal design of multilayered polysilicon films for prescribed curvature,” Journal of Materials Science, 38 (20), 4169-4173 (2003).
  • R. Ballarini, H. Kahn, A.H. Heuer, M.P. de Boer, and M.T. Dugger, “MEMS structures for on-chip testing of mechanical and surface properties of thin films,” in Comprehensive Structural Integrity Volume 8: Interfacial and Nanoscale Failure, W. Gerberich and W. Yang, eds. (Oxford: Elsevier Science) pp. 325-356, 2003.
  • B. Mi, H. Kahn, F. Merat, A.H. Heuer, D.A. Smith, and S.M. Phillips, “Design and fabrication of curved micromirrors using the MultiPoly process,” Proceedings of the IEEE Sensors 2003 Conference, Toronto, 22-24 Oct 2003, 42-45 (2003).
  • H. Kahn, R. Ballarini, and A.H. Heuer, “Surface oxide effects on static fatigue of polysilicon MEMS,” Materials Research Society Symposium Proceedings, Boston, MA, 2-6 Dec 2002, 741, J3.4.1-J3.4.6 (2003).
  • H. Kahn, R. Ballarini, J.J. Bellante, and A.H. Heuer, “Fatigue failure in polysilicon not due to simple stress corrosion cracking,” Science, 298 (5596), 1215-1218 (2002).
  • H. Kahn, R. Ballarini, and A.H. Heuer, “Thermal expansion of LPCVD polysilicon films,” Journal of Materials Research, 17 (7), 1855-1862 (2002).
  • H. Kahn, A.Q. He, and A.H. Heuer, “Homogeneous nucleation during crystallization of amorphous silicon produced by LPCVD,” Philosophical Magazine A, 82 (1), 137-165 (2002).
  • C.-L. Shih, B.-K. Lai, H. Kahn, S.M. Phillips, and A.H. Heuer, “A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS,” Journal of Microelectromechanical Systems, 10 (1), 69-79 (2001).
  • H. Kahn, A.H. Heuer, and R. Ballarini, “On-chip testing of mechanical properties of MEMS devices,” MRS Bulletin, 26 (4), 300-301 (2001).
  • H. Kahn and A.H. Heuer, “Thermal Stability of Residual Stresses (Residual Stress Gradients) in Multilayer LPCVD Polysilicon Films,” Journal of Ceramic Processing Research, 2 (4), 22-24 (2001).
  • R. Ballarini, H. Kahn, N. Tayebi, and A.H. Heuer, “Effects of microstructure on the strength and fracture toughness of polysilicon: a wafer level testing approach,” Mechanical Properties of Structural Films, ASTM STP 1413, 37-51 (2001).
  • H. Kahn and A.H. Heuer, “Polysilicon: mechanical properties,” in Encyclopedia of Materials: Science and Technology, K.H.J. Buschow, R.W. Cahn, M.C. Flemings, B. Ilschner, E. Kramer and S. Mahajan, eds. (New York: Pergamon Press) 2001.
  • D. Sherman, H. Kahn, S.M. Phillips, R. Ballarini, and A.H. Heuer, “The design of multilayered polysilicon for MOEMS applications,” Materials Research Society Symposium Proceedings, Boston, MA, 25-29 Nov 2000, 687, L8.10.1-L8.10.6 (2001).
  • H. Kahn, A.H. Heuer, and R. Ballarini, “On the fracture toughness of polysilicon MEMS structures,” Materials Research Society Symposium Proceedings, Boston, MA, 26-30 Nov 2000, 657, EE2.1.1-EE2.1.6 (2001).
  • B.-K. Lai, G. Hahm, L. You, C.-L. Shih, H. Kahn, S.M. Phillips, and A.H. Heuer, “The characterization of TiNi shape memory actuated microvalves,” Materials Research Society Symposium Proceedings, Boston, MA, 26-30 Nov 2000, 657, EE8.3.1-EE8.3.6 (2001).
  • C. Deeb, H. Kahn, X. Milhet, C. Zorman, M. Mehregany, and A.H. Heuer, “Low temperature (300ºC) formation of thermodynamically stable NiSi2 contacts to SiC,” Materials Research Society Symposium Proceedings, Boston, MA, 26-28 Nov 2000, 640, H5.22.1-H5.22.5 (2001).
  • J. Yang, H. Kahn, A.Q. He, S.M. Phillips, and A.H. Heuer, “A new technique for producing large-area as-deposited zero-stress LPCVD polysilicon films: the MultiPoly process,” Journal of Microelectromechanical Systems, 9 (4), 485-494 (2000).
  • H. Kahn, N. Tayebi, R. Ballarini, R.L. Mullen, and A.H. Heuer, “Fracture toughness of polysilicon MEMS devices,” Sensors and Actuators A, 82 (1-3), 274-280 (2000).
  • G. Hahm, H. Kahn, S.M. Phillips, and A.H. Heuer, “Fully microfabricated, silicon spring biased, shape memory actuated microvalve,” Proceedings of the Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, 4-8 June 2000, 230-233 (2000).
  • H. Kahn, N. Tayebi, R. Ballarini, R.L. Mullen, and A.H. Heuer, “Wafer-level strength and fracture toughness testing of surface-micromachined MEMS devices,” Materials Research Society Symposium Proceedings, Boston, MA, 29 Nov-3 Dec 1999, 605, 25-30 (2000).
  • J. Yang, H. Kahn, A.Q. He, S.M. Phillips, and A.H. Heuer, “Control of residual stresses in as-grown polysilicon by multi-layer deposition: the ‘Multipoly’ process,” Materials Research Society Symposium Proceedings, Boston, MA, 29 Nov-3 Dec 1999, 605, 37-42 (2000).
  • H. Kahn, R. Ballarini, R.L. Mullen, and A.H. Heuer, “Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimens,” Proceedings of the Royal Society of London A, 455 (1990), 3807-3823 (1999).
  • H. Kahn, A.H. Heuer, and S.J. Jacobs, “Materials Issues in MEMS,” Materials Today, 2 (2), 3-7 (1999).
  • H. Kahn, N. Tayebi, R. Ballarini, R.L. Mullen, and A.H. Heuer, “Fracture and fatigue of polysilicon MEMS devices,” Proceedings of the 10th IEEE International Conference on Solid-State Sensors and Actuators, Transducers 99, Sendai, Japan, 7-10 June 1999, 2, 924-927 (1999).
  • N. Tayebi, H. Kahn, R. Ballarini, R.L. Mullen, and A.H. Heuer, “Electrostatically loaded polysilicon MEMS fracture device with sharp crack,” Proceedings of the International Conference on Integrated Micronanotechnology for Space Applications, Pasadena, CA, Apr 1999, 2, 360-365 (1999).
  • H. Kahn, M.A. Huff, and A.H. Heuer, “The TiNi shape memory alloy and its applications for MEMS,” Journal of Micromechanics and Microengineering, 8 (3), 213-221 (1998).
  • W.L. Benard, H. Kahn, A.H. Heuer, M.A. Huff, “Thin film shape memory alloy actuated micropumps,” Journal of Microelectromechanical Systems, 7 (2), 245-251 (1998).
  • RH. Kahn, M.A. Huff, and A.H. Heuer, “Heating effects on the Young’s modulus of films sputtered onto micromachined resonators,” Materials Research Society Symposium Proceedings, San Francisco, CA, 13-17 Apr 1998, 518, 33-38 (1998).
  • R. Ballarini, R.L. Mullen, H. Kahn, and A.H. Heuer, “The fracture toughness of polysilicon microdevices,” Materials Research Society Symposium Proceedings, San Francisco, CA, 13-17 Apr 1998, 518, 137-142 (1998).
  • H. Kahn, M.J. Troyer, V.R. Prabhu, C.-L. Shih, S.R. Phillips, M.A. Huff, and A.H. Heuer, “Single crystal silicon as a micromechanical material,” Integrated Thin Films and Applications Symposium Proceedings, Cincinnati, 4-7 May 1997, Ceramic Transactions, 86, 119-124 (1998).
  • R. Ballarini, R.L. Mullen, Y. Yin, H. Kahn, S. Stemmer, and A.H. Heuer, “The fracture toughness of polysilicon microdevices: a first report,” Journal of Materials Research, 12 (4), 915-922 (1997).
  • C.A. Zorman, M. Mehregany, H. Kahn, and A.H. Heuer, “New developments in MEMS using SiC and shape memory materials,” Current Opinion in Solid State and Materials Science, 2 (5), 566-570 (1997).
  • H. Kahn, W.L. Benard, M.A. Huff, and A.H. Heuer, “Titanium-nickel shape memory thin film actuators for micromachined valves,” Materials Research Society Symposium Proceedings, Boston, MA, 2-6 Dec 1996, 444, 227-232 (1997).
  • W.L. Benard, H. Kahn, and M.A. Huff, “A TiNi shape-memory alloy actuated micropump with fluid isolation,” Proceedings of the SPIE Symposium on Smart Structures and Materials, Smart Electronics and MEMS, San Diego, CA, 4-6 Mar 1997, 3046, 156-164 (1997).
  • W.L. Benard, H. Kahn, and M.A. Huff, “A titanium nickel shape-memory alloy actuated micropump,” Proceedings of the 9th IEEE International Conference on Solid-State Sensors and Actuators, Transducers 97, Chicago, IL, 16-19 June 1997, 1, 361-364 (1997).
  • H. Kahn, S. Stemmer, K. Nandakumar, A.H. Heuer, R.L. Mullen, R. Ballarini, and M.A. Huff, “Mechanical properties of thick, surface micromachined polysilicon films,” Proceedings of the 9th IEEE International Workshop on Microelectromechanical Systems, MEMS 96, San Diego, CA, 11-15 Feb 1996, 343-348 (1996).
  • H. Kahn, S. Stemmer, R.L. Mullen, M.A. Huff, and A.H. Heuer, “Polycrystalline silicon films for microelectromechanical devices,” Materials Research Society Symposium Proceedings, Boston, MA, 27 Nov-1 Dec 1995, 403, 321-326 (1996).
  • C.V. Thompson and H. Kahn, “Effects of microstructure on interconnect and via reliability: multimodal failure statistics,” Journal of Electronic Materials, 22 (6), 581-587 (1993).
  • H. Kahn, C.V. Thompson, and S.S. Cooperman, “Reliability of interconnects exhibiting bimodal electromigration-induced failure distributions,” Materials Research Society Symposium Proceedings, San Francisco, CA, 27 Apr-1 May 1992, 265, 65-70 (1992).
  • H. Kahn and C.V. Thompson, “Effect of applied mechanical stress on the electromigration failure times of aluminum interconnects,” Applied Physics Letters, 59 (11), 1308-1310 (1991).
  • H. Kahn and C.V. Thompson, “A statistical characterization of electromigration-induced via open failures,” Materials Research Society Symposium Proceedings, Anaheim, CA, 30 Apr-3 May 1991, 225, 15-20 (1991).